To provide a method of manufacturing an electronic component built-in substrate by which a plurality of electronic component built-in substrates can be efficiently manufactured at the same time.
The electronic component built-in substrate is manufactured by heating and pressurizing at the same time, a first insulating layer including at least a non-cured thermosetting resin, a second insulating layer which is stacked on the upper surface of the first insulating layer and includes at least a non-cured thermosetting resin, a first metallic foil stacked on the upper surface of the second insulating layer, a third insulating layer which is stacked on the surface of the substrate wherein the electronic component is not mounted and which includes at least a non-cured thermosetting resin, and a second metallic foil stacked on the upper surface of the third insulating layer.
HONJO KAZUHIKO
MORI TOSHIHIKO
SUGAYA YASUHIRO
KATSUMATA MASAAKI
Hiroki Naito
Daisuke Nagano