Title:
METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2020188190
Kind Code:
A
Abstract:
To suppress an unburnt internal electrode from having a polishing sag when a side face of an unburnt laminate is polished.SOLUTION: A method of manufacturing an electronic component comprises the processes of: preparing an unburnt laminate having a first principal surface and a second principal surface facing each other in a lamination direction, a first side face and a second side face facing each other in a width direction, and a first end face and a second end face facing each other in a length direction; bonding one of first side faces and second side faces of a plurality of unburnt laminates to a pressure-sensitive adhesive sheet; rotating a polishing surface of a rotary polishing machine in contact with the other of the first side faces and second side faces of the unburnt laminates to polish the other side faces; and forming a first insulation layer on the polished other side faces. In the process of polishing the other side faces, at least one of the rotary polishing machine and pressure-sensitive adhesive sheet 31 is moved relatively to the other so as to form polishing grooves in the length direction L.SELECTED DRAWING: Figure 10
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Inventors:
SUMI AKIRA
Application Number:
JP2019092776A
Publication Date:
November 19, 2020
Filing Date:
May 16, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30; H01G13/00
Attorney, Agent or Firm:
Hitoshi Nishizawa
Takahiro Nosue
Takahiro Nosue