To provide a method for manufacturing an electronic substrate by which the work efficiency of laser processing can be improved, the number of substrates to be made from one metallic substrate material can be increased, and manufacturing efficiency can be also improved.
Fitting holes 13A are continuously formed on the short side 11b1 of an electronic substrate 11. Thus, they can be continuously formed without interrupting the irradiation of laser light, so that the utilization efficiency of the laser processing machine can be improved and the processing work efficiency be also improved. In addition, the fitting holes 13A to be used as an identification mark are provided inside the electronic substrate 11. Thus, the number of electronic substrates 11 to be made from one original plate 20 can be increased, and the manufacturing efficiency of the electronic substrate 11 can be improved.
MAEDA RYOICHI
TERAUCHI YOSHIHARU
OMAE CHIKASHI
| JPH11317570A | 1999-11-16 | |||
| JPH0249161U | 1990-04-05 | |||
| JPS63105087U | 1988-07-07 | |||
| JP2003185508A | 2003-07-03 | |||
| JPH11191668A | 1999-07-13 | |||
| JPH09214080A | 1997-08-15 |
Masayoshi Miwa
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