Title:
METHOD OF MANUFACTURING FLIP CHIP TYPE IC
Document Type and Number:
Japanese Patent JP3694679
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a flip chip type IC permitting satisfactory face down bonding to a circuit board.
SOLUTION: A flip chip type IC is manufactured by a process of dividing one main surface of a silicon wafer 1a into a plurality of blocks and allowing a plurality of barrier metal layers 3 to adhere to the vicinity of a boundary between the adjoining blocks inside each block and passivation layers 4 to adhere to the region where the barrier metal layer 3 does not exist; a process of forming a pair of grooves 7a and 7b between the adjoining blocks by zonally removing the passivation layers 4 that are located at both ends in the width direction of the boundary along the boundary; a process of printing and applying solder paste 5' on the barrier metal layer 3 and allowing this to reflow to form a solder bump 5; and a process of obtaining a plurality of flip chip type ICs by dicing the silicon wafer 1a between a pair of grooves 7a and 7b and dividing the silicon wafer 1a for each block.
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Inventors:
Shimoaki Yoshio
Application Number:
JP2002099923A
Publication Date:
September 14, 2005
Filing Date:
April 02, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2000040711A | ||||
| JP7201869A | ||||
| JP10242632A | ||||
| JP7201870A | ||||
| JP2000100853A |
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