Title:
高熱伝導性樹脂部材の製造方法及び、当該製造方法を用いて製造された樹脂部材
Document Type and Number:
Japanese Patent JP7110040
Kind Code:
B2
Abstract:
To provide a resin member having excellent thermal conductivity and a method for manufacturing the resin member.SOLUTION: After preparing a thermally conductive filler-containing compound having a volume ratio between a thermally conductive filler and a thermoplastic resin of 10:90 to 40:60 (step A), using the thermally conductive filler-containing compound, a filament is extruded and laminate-molded by a hot-melt laminating three-dimensional printer to produce a resin member having an internal structure in which the thermally conductive filler contained in each filament is oriented along a longitudinal direction of the filament (Step B). As the heat conductive filler in the step A, graphite, boron nitride, aluminum nitride, zinc oxide, carbon nanotube, aluminum oxide, magnesium oxide and the like are preferable.SELECTED DRAWING: Figure 1
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Inventors:
Nozomi Hayashida
Makoto Wada
Yuki Inoue
Ogasawara Eidai
Kazuyuki Kato
Koji Kawakita
Makoto Wada
Yuki Inoue
Ogasawara Eidai
Kazuyuki Kato
Koji Kawakita
Application Number:
JP2018169579A
Publication Date:
August 01, 2022
Filing Date:
September 11, 2018
Export Citation:
Assignee:
Daiichi Ceramo Co., Ltd.
International Classes:
B29C64/118; B29C64/165; B33Y10/00; B33Y70/10; B33Y80/00
Domestic Patent References:
| JP2016028887A | ||||
| JP2017213813A |
Foreign References:
| WO2015129733A1 | ||||
| WO2018043231A1 |
Attorney, Agent or Firm:
Patent Business Corporation Minori Patent Office