Title:
吸湿性樹脂フィルムの製造方法
Document Type and Number:
Japanese Patent JP7056187
Kind Code:
B2
Abstract:
To provide a manufacturing method of a hygroscopic resin film capable of being used in an application such as an encapsulation film or the like in an electronic device such as an organic EL device, and capable of achieving easy manufacturing of a film low in haze.SOLUTION: There is provided a manufacturing method of a hygroscopic resin film including a process A for dispersing a hygroscopic particle having primary particle diameter of 200 nm or less in a nonpolar solvent 1 to obtain a hygroscopic particle dispersion, a process B for dissolving a polymer in a nonpolar solvent 2 having compatibility with the solvent 1 to obtain a polymer solution, in which the polymer is selected from a group consisting of an aromatic vinyl-conjugated diene block copolymer, hydride thereof, a polymer having a structure obtained by a graft polymerization of them and a monomer having a polar group, and a mixture thereof, and a process C for mixing the hygroscopic particle dispersion and the polymer solution to manufacture a mixture, and a process D for applying the mixture onto a substrate and drying them.SELECTED DRAWING: None
Inventors:
Hiroyasu Inoue
Application Number:
JP2018015605A
Publication Date:
April 19, 2022
Filing Date:
January 31, 2018
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08F8/04; C08J5/18; C08F287/00; C08F297/04; C08K3/01; C08L53/02
Domestic Patent References:
| JP2006272190A | ||||
| JP2016522304A | ||||
| JP2017117721A |
Foreign References:
| WO2018155311A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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