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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING INERTIA SENSOR CHIP AND INERTIA SENSOR CHIP SEMI-FINISHED GOODS
Document Type and Number:
Japanese Patent JP2000111349
Kind Code:
A
Abstract:

To use pure water for preventing the entry of dust to a small gap by absorbing and reducing pressure being applied to a fragile part in inertial sensor chip semi-finished goods caused by accumulated inflation and preventing the damage.

Semi-finished goods are provided with a single silicon substrate or a mass part formation substrate 1 where a number of inertia sensor mass parts 11 are formed in a matrix by applying a melted crystal substrate bulk micro-machining manufacturing technology and is composed by sandwiching the mass part formation substrate 1 between an upper support substrate 2 and a lower support substrate 3 and joining the three in one piece. In this case, diaphragm parts 21 and 31 are formed at one or both of the upper support substrate 2 and the lower support substrate 3.


Inventors:
YABE HISASHI
AIZA AKITOSHI
Application Number:
JP28633498A
Publication Date:
April 18, 2000
Filing Date:
October 08, 1998
Export Citation:
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Assignee:
JAPAN AVIATION ELECTRON
International Classes:
G01C19/56; B81B3/00; B81C3/00; G01C19/5663; H01L21/301; H01L29/84; (IPC1-7): G01C19/56; G01P9/04; H01L21/301; H01L29/84
Attorney, Agent or Firm:
Kusano Taku (1 person outside)