Title:
積層型電子部品の製造方法
Document Type and Number:
Japanese Patent JP7151095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer electronic component having an element body formed by laminating a function part and a conductor part by a simplified process in a state where formation accuracy of a laminate is extremely excellent.SOLUTION: Disclosed is a method of manufacturing a multilayer electronic component having an element body in which a function part and a conductor part are laminated. This method includes a step of forming a green laminate 11 on a temporary holding film 62 formed on a peeling substrate 61. The green laminate 11 is formed by repeating a first step of forming a green function part using the first ink containing functional particles, and a second step of forming a green conductor part using the second ink containing conductive particles.SELECTED DRAWING: Figure 5
Inventors:
Atsushi Sato
Yukari Wada
Yukari Wada
Application Number:
JP2018028269A
Publication Date:
October 12, 2022
Filing Date:
February 20, 2018
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01G4/30; H01G13/00
Domestic Patent References:
| JP2002170737A | ||||
| JP2010153605A | ||||
| JP2013213295A | ||||
| JP2011151281A |
Foreign References:
| WO2013145865A1 |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation