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Title:
METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DIODE CHIP
Document Type and Number:
Japanese Patent JP2018074110
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting diode chip capable of obtaining sufficient luminance, and the light-emitting diode chip.SOLUTION: A method for manufacturing a light-emitting diode chip comprises: a wafer preparing step of preparing a wafer which includes a laminate layer in which a plurality of semiconductor layers containing a light-emitting layer are formed on a transparent substrate for crystal growth, and in which an LED circuit is formed in each of the regions partitioned by a plurality of division schedule lines mutually crossing a surface of the laminate layer; a transparent substrate processing step of forming a plurality of dents corresponding to each LED circuit of the wafer on a rear surface of the transparent substrate in which a plurality of air bubbles are formed inside; an integrating step of forming an integrated wafer by sticking the surface of the transparent substrate to a rear surface of the wafer after performing the transparent substrate processing step; and a dividing step of dividing the integrated wafer into individual light-emitting diode chips by cutting the wafer together with the transparent substrate along the division schedule lines.SELECTED DRAWING: Figure 3

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Inventors:
OKAMURA TAKU
KITAMURA HIROSHI
Application Number:
JP2016216396A
Publication Date:
May 10, 2018
Filing Date:
November 04, 2016
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L33/32; B23K26/382; H01L21/301; H01L21/683
Domestic Patent References:
JP2005093728A2005-04-07
JP2006093686A2006-04-06
JP2014239123A2014-12-18
JP2006278751A2006-10-12
JP2015192100A2015-11-02
JP2006041479A2006-02-09
JP2012038889A2012-02-23
JP2014138176A2014-07-28
JP2007266472A2007-10-11
JP2016521463A2016-07-21
Foreign References:
WO2013114480A12013-08-08
WO2015030237A12015-03-05
US20140159090A12014-06-12
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro



 
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