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Title:
METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DIODE CHIP
Document Type and Number:
Japanese Patent JP2018148016
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting diode chip capable of obtaining sufficient luminance, and the light-emitting diode chip.SOLUTION: A method for manufacturing a light-emitting diode chip comprises: a wafer preparing step of preparing a wafer which includes a laminate layer in which a plurality of semiconductor layers including light-emitting layers are formed on a transparent substrate for crystal growth, and in which an LED circuit 19 is formed in each of regions partitioned by a plurality of division schedule lines mutually crossing a surface of the laminate layer; a transparent substrate processing step of forming a plurality of grooves 23B corresponding to the LED circuits on a surface or a rear surface of at least one of a first and second transparent substrates in which a plurality of air bubbles are formed inside; a transparent substrate sticking step of forming an integrated wafer by sticking a surface of the first transparent substrate to a rear surface of the wafer and a surface of the second transparent substrate to a rear surface of the first transparent substrate; and a dividing step of dividing the integrated wafer into individual light-emitting diode chips 31 by cutting the wafer together with the first transparent substrate and the second transparent substrate along the division schedule lines.SELECTED DRAWING: Figure 9

Inventors:
OKAMURA TAKU
Application Number:
JP2017041315A
Publication Date:
September 20, 2018
Filing Date:
March 06, 2017
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L33/20; B23K26/364; B23K26/53; B24B27/06; B24C1/00; B24C3/32; H01L21/301; H01L33/02
Domestic Patent References:
JP2016521463A2016-07-21
JP2012099788A2012-05-24
JP2005093728A2005-04-07
JP2015018953A2015-01-29
JP2014239123A2014-12-18
Foreign References:
WO2013114480A12013-08-08
US20140159090A12014-06-12
KR101662751B12016-10-07
KR20150062194A2015-06-08
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro