Title:
光源モジュールの製造方法、光源モジュール及び移動体
Document Type and Number:
Japanese Patent JP7149496
Kind Code:
B2
Abstract:
To provide a manufacturing method of light source module capable of inspecting the mounting state of a light source element by image recognition.SOLUTION: A manufacturing method of light source module includes a mounting step of mounting a light source element 200, having a package 210 of the similar color as the surface of a board 100, on the exposed part of the conductive layer 120 of the board 100, and an inspection step for inspecting the mounting state of the light source element 200 by image recognition, after the mounting step. In the plan view, the exposed part of the conductive layer 120 has a first squeeze-out region 131b squeezing out from one side of the contour of the package 210, and a second squeeze-out region 131c elongating from the first squeeze-out region 131b, and squeezing out from other side orthogonal to one side of the contour of the package 210.SELECTED DRAWING: Figure 6
Inventors:
Hiroya Tsuji
Hiroshi Aoki
Hiroshi Aoki
Application Number:
JP2018064691A
Publication Date:
October 07, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L33/48; F21S41/141
Domestic Patent References:
| JP2018006483A |
Foreign References:
| WO2006104032A1 | ||||
| US20080316724 |
Attorney, Agent or Firm:
Hiroi Arai
Teraya Eisaku
Shinichi Michizaka
Teraya Eisaku
Shinichi Michizaka
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