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Patent Searching and Data


Title:
METHOD OF MANUFACTURING MASK BLANK, AND METHOD OF MANUFACTURING PHOTOMASK
Document Type and Number:
Japanese Patent JP2008283099
Kind Code:
A
Abstract:

To provide a manufacturing method of a mask blank capable of surely starting solution-contact, when applying a resist solution by using a slit coater device, such as a CAP coater, and capable of preventing the occurrence of unevenness in application caused by a solution-contact gap.

The manufacturing method of a mask blank having a resist film has a resist solution coating process for coating a surface to be coated with the resist solution, by making a coating nozzle and the surface to be coated relatively scan in a substrate in a direction crossing one direction while the resist solution is being discharged from the coating nozzle that is extended in one direction and has a resist solution supply port; and a process for starting the solution-contact, while the space between the tip of the coating nozzle and the surface to be coated is relatively small, when the surface to be coated in the substrate is brought closer to the tip of the coating nozzle to allow the solution-contacting of the surface to be coated to the resist solution, and then for widening the space between the tip of the coating nozzle and the surface to be coated to a relatively large value and make the liquid-contact completed.


Inventors:
ASAKAWA TAKASHI
MIYATA RYOJI
Application Number:
JP2007127634A
Publication Date:
November 20, 2008
Filing Date:
May 14, 2007
Export Citation:
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Assignee:
HOYA CORP
HOYA ELECTRONICS MALAYSIA SDN
International Classes:
H01L21/027; G03F1/50; G03F1/54
Attorney, Agent or Firm:
Yasuo Fujimura