To manufacture ultra-fine metal particles with a nanometric size not more than several micrometers, and to form a fine conductor circuit pattern on a circuit board with the use of the ultrafine metal particles.
The method for manufacturing the metal microparticles comprises arranging a pair of discs so as to make the disc faces oppose each other and approach each other into a touchable distance; radially arranging dimple-shaped channels in the face of one disc; while rotating the other disc at a high speed, introducing the metal particles to the dimple-shaped channels; and pulverizing the metal particles at the end of the channels by shear stress due to a difference of a rotational speed between both discs. The substance containing the metal microparticles and the electroconductive coating composition containing the metal microparticles are disclosed.
OHASHI YUJI
ONO TAKAO
