Title:
金属化ポリイミドフィルムの製造方法
Document Type and Number:
Japanese Patent JP4397702
Kind Code:
B2
Abstract:
A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m2.
Inventors:
Masayuki Aida
Application Number:
JP2004027660A
Publication Date:
January 13, 2010
Filing Date:
February 04, 2004
Export Citation:
Assignee:
Mitsubishi Shindoh Co., Ltd.
International Classes:
B32B15/088; B32B15/08; C23C14/02; C23C14/20; C23C14/48; H01L21/60; H05K1/05; H05K3/38; H05K1/03
Domestic Patent References:
| JP7197239A | ||||
| JP8332697A | ||||
| JP2003011273A | ||||
| JP2050493A | ||||
| JP2004303863A | ||||
| JP2005125721A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama