成形型および半貫通穴を有する成形品の製造方法

Japanese Patent JP6806496

B2

PROBLEM TO BE SOLVED: To provide a production method of a forming die capable of making a thin wall part of a semi-through hole near as far as possible to a designing thickness and a forming product having a semi-through hole.SOLUTION: A forming die is a forming die for forming a forming material 3 into a formed product having a semi-through hole 41. The forming die is provided with a die having two faces in which forming faces are opposed. Any one of two faces of the die is provided with a pin part 23, and the other part has an opposition part 13 corresponding to the pin part 23. The pin part 23 is constituted such that a tip end face 24 of the pin part 23 opposes to an opposition part 13 when a die having two faces are die-closed. When the die is opened from a die-closed state, a positional relationship between the tip end face 24 and the opposition part 13 of the pin part 23 is maintained until the one die and the other die relatively move in the direction of departing a predetermined dimension, and after the one die and the other die move in the direction of relatively departing by a predetermined dimension, the tip end face 24 and the opposition part 13 of the pin part 23 move in the direction of departing from each other.SELECTED DRAWING: Figure 2

Kawabata Kosuke
Ryo Maeda

JP2016165772A

January 06, 2021

August 26, 2016

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KMEW Co., Ltd.

B28B3/02; B29C33/44

JP2000006125A
JP6182736A
JP47004939Y1
JP8001629A
JP2014172401A
JP10296499A

Patent business corporation Hokuto patent office
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura

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