積層セラミックチップの製造方法および積層セラミックチップ製造用の焼成前チップの製造方法

Title:

積層セラミックチップの製造方法および積層セラミックチップ製造用の焼成前チップの製造方法

Document Type and Number:

Japanese Patent JP7182780

Kind Code:

B2

Abstract:

To suitably manufacture a ceramic chip in which a resin layer is layered on a ceramic base material.SOLUTION: A method for manufacturing a laminate ceramic chip includes: a parting step of parting a mother substrate before firing in which resin layers are provided on both surfaces of a plate-like ceramic molding in a thickness direction along a plurality of parting planned positions to obtain a chip before firing; and a firing step of firing the chip before firing to obtain a laminate ceramic chip, in which the parting step subjects all of the plurality of parting planned positions to a step of horizontally mounting the mother substrate before firing on a pair of receiving blades separated from each other at an interval smaller than the interval between the adjacent parting planned positions with a surface provided with the resin layer as a lower surface so that a distance between the parting planned position and both of the receiving blades becomes equal, and a step of bringing a brake plate into contact with the parting planned position from the upper surface side of the mother substrate before firing, pressing down the brake plate, thereby extending a crack from the resin layer on the lower surface side, and thereby parting the mother substrate before firing at the parting planned position.SELECTED DRAWING: Figure 2

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Inventors:

Mitsuki Eida
Masakazu Takeda

Application Number:

JP2018236158A

Publication Date:

December 05, 2022

Filing Date:

December 18, 2018

Export Citation:

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