Title:
めっき線材の製造方法およびめっき線材の製造装置
Document Type and Number:
Japanese Patent JP7209157
Kind Code:
B2
Abstract:
A manufacturing method of a plated wire rod, the method including: preparing a plated wire rod precursor including a base material that is wire-drawn and that has a linear shape and a plating film that is provided on a surface of the base material, where the base material is made of first metal and the plating film is made of second metal of a different composition from the first metal; obtaining a plated wire rod-intermediate body by performing skin-passing on the plated wire rod precursor using a die; inspecting, after the skin-passing, for presence/absence of a defect in the plated wire rod-intermediate body using an eddy current testing device and a camera inspection device; and obtaining a plated wire rod by removing the defect in the plated wire rod-intermediate body that is detected in the inspecting.
Inventors:
Hitoshi Tsuchida
Dai Kamogawa
Tadashi Ohmura
Toshitaka Nakagawa
Dai Kamogawa
Tadashi Ohmura
Toshitaka Nakagawa
Application Number:
JP2019569857A
Publication Date:
January 20, 2023
Filing Date:
August 22, 2019
Export Citation:
Assignee:
Toyama Sumitomo Electric Co., Ltd.
International Classes:
B21C51/00; B21B38/00; B21C1/00; C25D5/48; G01N21/892; G01N27/90; H01B5/02; H01B13/00
Domestic Patent References:
| JP2016539008A | ||||
| JP2015120966A | ||||
| JP2015029995A |
Attorney, Agent or Firm:
Masami Sakai
Yoshikuni Suda
Yoshikuni Suda
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