Title:
METHOD FOR MANUFACTURING POLYAMIC ACID AND POLYIMIDE, AND ADHESIVE TAPE OBTAINED BY USING THEM
Document Type and Number:
Japanese Patent JP2002060489
Kind Code:
A
Abstract:
To provide a method for manufacturing a polyimide having a three- dimensional structure which is optimal as the material for high temperature adhesives and heat-resistant films and has all of excellent heat resistance, mechanical properties and high temperature adhesion properties and a polyamic acid as its precursor.
This method for manufacturing a polyamic acid and a polyimide comprises reacting at least each one of an aromatic diamine, a diamine containing a siloxane structure represented by formula (I), and an alkyl- or aryl-cyclohexylidene dianiline of chemical formula (II) or chemical formula (III) as the diamines with a tetracarboxylic dianhydride.
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Inventors:
KUON JION MIN
KIMU SUN SHIKU
SAN KYON HO
RI KYON ROKKU
KIMU SUN SHIKU
SAN KYON HO
RI KYON ROKKU
Application Number:
JP2000239006A
Publication Date:
February 26, 2002
Filing Date:
August 07, 2000
Export Citation:
Assignee:
SAEHAN IND INC
International Classes:
C09J7/02; C08G73/10; C09J179/08; (IPC1-7): C08G73/10; C09J7/02; C09J179/08
Attorney, Agent or Firm:
Etsushi Kotani (1 person outside)