Title:
ポリイミド積層体の製造方法及びフレキシブル回路基板の製造方法
Document Type and Number:
Japanese Patent JP6904351
Kind Code:
B2
Abstract:
Disclosed is a method for producing a polyimide laminate, the method including the steps of applying a polyimide precursor solution onto a substrate and heating the polyimide precursor solution, to thereby form a polyimide film layer on the substrate. The substrate is any plate selected from a glass plate, a metal plate, and a ceramic plate. The heating step includes irradiation with far infrared rays using an infrared heater that generates a maximum radiant energy at an infrared wavelength of 3.5 to 6 μm. The highest heating temperature is preferably 350 to 550° C. The time required to increase the temperature from 180 to 280° C. during a temperature-increasing process is preferably 2 minutes or longer.
Inventors:
Kazuki Narita
Takenari Nakayama
Naoki Kitayama
Shohei Inoue
Takenari Nakayama
Naoki Kitayama
Shohei Inoue
Application Number:
JP2018527676A
Publication Date:
July 14, 2021
Filing Date:
July 14, 2017
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
B32B38/18; B05D3/02; B05D7/24; B32B15/088; B32B17/10; B32B18/00; H05K1/03
Domestic Patent References:
| JP2138340A | ||||
| JP2006192861A | ||||
| JP2000072901A | ||||
| JP2012210780A | ||||
| JP2006142663A |
Foreign References:
| WO2014156536A1 | ||||
| WO2013024849A1 |
Attorney, Agent or Firm:
Showa International Patent Office