To provide a method of manufacturing a printed-wiring board, in which even a thin insulating board can be conveyed easily and in which a manufacturing process can be simplified.

In a single-sided copper-clad laminate 2, a support film 6 is laminated on a face on the side of the insulating board 3. Thereby, the laminate 2 can be kept easily in a horizontal posture on a roller conveyer 15 during its conveyance, and the laminate 2 can be prevented from falling off. When the laminate 2 is formed to have a thickness as a whole, it can be sandwiched surely between upper rollers 16A and lower rollers 16B so as to be conveyed, and the rollers 16A, 16B can be prevented from idling. The support film 6 can also play a role of protecting conductive bumps 5 in an etching process. Thereby, the production process can be simplified.