METHOD OF MANUFACTURING RFID INLAY

Title:

METHOD OF MANUFACTURING RFID INLAY

Document Type and Number:

Japanese Patent JP2021140670

Kind Code:

A

Abstract:

To stably mount an IC chip on an antenna pattern by using an anisotropic conductive material.SOLUTION: A method for manufacturing an RFID inlay by connecting an IC chip to an antenna pattern formed on a substrate includes: a pre-heating process which heats the substrate with the antenna pattern formed thereon on a specific condition; and a mounting process which mounts an IC chip on the antenna pattern via an anisotropic conductive material after the pre-heating process.SELECTED DRAWING: Figure 3

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Inventors:

NITTA HARUHIKO

Application Number:

JP2020040122A

Publication Date:

September 16, 2021

Filing Date:

March 09, 2020

Export Citation:

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Assignee:

SATO HOLDINGS CORP

International Classes:

G06K19/077; G06K19/02; G06K19/07; H01P11/00; H01Q1/24

Attorney, Agent or Firm:

Goto Patent Office

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