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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SEAMLESS SILICONE LABEL
Document Type and Number:
Japanese Patent JP2002018867
Kind Code:
A
Abstract:

To provide a method for manufacturing a seamless silicone label easy to manufacture capable of three-dimensionally expressing various patterns, not imparting a stiff feeling or an unpleasant feeling to a wearer at the time of adhesion to clothes, and being easily bonded to clothes even if seaming work is not performed.

A predetermined label pattern is formed by a mold and silicone rubber mixed with desired pigment is injected in the label pattern on the mold. The surface of the mold is scraped off and the mold is bonded on a label raw fabric and pressed by predetermined heat and pressure to mold the label pattern. The mold, to which the label raw fabric is bonded, is overturned to bond adhesive paper and the adhesive paper is bonded to the rear surface of the label raw fabric by a press means. The mold is again overturned to separate the label raw fabric from the mold and respective labels are individually separated.


Inventors:
KIN EITETSU
Application Number:
JP2001065047A
Publication Date:
January 22, 2002
Filing Date:
March 08, 2001
Export Citation:
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Assignee:
DAEWON HIGHTECH KK
International Classes:
B29C39/02; B29C33/12; B29C39/22; B29C69/00; G09F3/00; G09F3/04; G09F3/10; (IPC1-7): B29C39/02; B29C39/22; G09F3/00; G09F3/10
Attorney, Agent or Firm:
Kamei Miaki (3 others)