Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2012204456
Kind Code:
A
Abstract:
To provide a method for manufacturing a semiconductor device capable of improving selectivity of a mask for forming a pattern on a material to be processed, reducing processing cost, and improving yield.
An organic film with a predetermined pattern is formed on a material to be processed. A metallic element is introduced into the organic film with the predetermined pattern. The material to be processed is etched using the organic film with the predetermined pattern into which the metallic element is introduced.
Inventors:
IMAMURA TSUBASA
HAYASHI HISATAKA
HAYASHI HISATAKA
Application Number:
JP2011065745A
Publication Date:
October 22, 2012
Filing Date:
March 24, 2011
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/3065; G03F7/40; H01L21/027; H01L21/3213; H01L21/768
Attorney, Agent or Firm:
Amagi International Patent Office
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