Title:
METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2015103536
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light-emitting device capable of suppressing leakage of light from a lateral face of a light-transmissive resin provided at a top surface side in a semiconductor light-emitting element region.SOLUTION: A method of manufacturing a semiconductor light-emitting device includes the following steps of: forming a plurality of semiconductor light-emitting element regions on a substrate; forming a recessed part on a surface of the substrate between the plurality of semiconductor light-emitting element regions; providing a light-reflective encapsulation resin on the substrate to cover the plurality of semiconductor light-emitting element regions with the encapsulation resin, and filling the recessed part with a part of the encapsulation resin covering the plurality of semiconductor light-emitting element regions; peeling out the substrate; providing a light-transmissive resin on a surface at a side where the substrate existed, of the plurality of semiconductor light-emitting element regions; and individualizing the plurality of semiconductor light-emitting element regions. The recessed part includes a first recessed part, and one or more second recessed parts having a depth shallower than that of the first recessed part.
Inventors:
IKEDA TADAAKI
Application Number:
JP2013240553A
Publication Date:
June 04, 2015
Filing Date:
November 21, 2013
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L33/60; H01L33/54
Domestic Patent References:
| JP2013225640A | 2013-10-31 | |||
| JP2013232539A | 2013-11-14 | |||
| JP2011071272A | 2011-04-07 |
Attorney, Agent or Firm:
Masayuki Kanita