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Title:
METHOD OF MANUFACTURING STACKED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2005285801
Kind Code:
A
Abstract:

To provide a stacked electronic component which can prevent the peeling-off of the peripheral part of a plating metal thin film even if the plating metal thin film is used as a conductor layer to be formed inside, and can also prevent internal defects such as delamination; and to provide its manufacturing method.

The stacked type electronic component comprises a rectangular parallellepiped ceramic main body 1 made by stacking ceramic layers 5, and the conductor layers 7 consisting of a plating film which are so formed as to be overlaid on the ceramic layers 5 inside the ceramic main body 1 and are drawn to one end face 9 side of the ceramic main body 1 to contribute to forming a capacitance. Each conductor layer 7 consisting of a plating film has its peripheral edge portion 17 formed thicker than the inside region 19.


Inventors:
SUGIMOTO KOUSHIROU
YAMAGUCHI KATSUYOSHI
ITO YUMIKO
Application Number:
JP2004092774A
Publication Date:
October 13, 2005
Filing Date:
March 26, 2004
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01G4/12; B32B3/00; B32B18/00; C23C4/00; C25D1/00; H01G4/012; H01G4/232; H01G4/30; (IPC1-7): H01G4/12; H01G4/30
Domestic Patent References:
JPH0935986A1997-02-07
JP2001060516A2001-03-06
JP2000106321A2000-04-11
JP2003178926A2003-06-27
JP2003063863A2003-03-05
JP2002075771A2002-03-15
JPH0757960A1995-03-03
JP2002329638A2002-11-15



 
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