Title:
基板接合体の製造方法、液体吐出ヘッド用基板、および液体吐出ヘッド用基板の製造方法
Document Type and Number:
Japanese Patent JP7346131
Kind Code:
B2
Abstract:
A substrate laminated body is formed by joining a first substrate for forming a part of a device and a second substrate for forming another part of the device. The first and second substrates are joined by a method comprising: a temporarily joining step of arranging an adhesive agent outside a device forming region and temporarily joining the device forming regions of the first substrate and the second substrate to be held in a non-contact state, and a finally joining step of forming a film so as to fill a gap between the device forming regions in the non-contact state and finally joining the first substrate and the second substrate by way of the film.
Inventors:
Taichi Yonemoto
Application Number:
JP2019138741A
Publication Date:
September 19, 2023
Filing Date:
July 29, 2019
Export Citation:
Assignee:
Canon Inc
International Classes:
B41J2/16
Domestic Patent References:
| JP2018171911A |
Foreign References:
| US20190217618 |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata