METHOD FOR MANUFACTURING SUBSTRATE WITH ROUGHENED SURFACE AND PLATED LAYER

Title:

METHOD FOR MANUFACTURING SUBSTRATE WITH ROUGHENED SURFACE AND PLATED LAYER

Document Type and Number:

Japanese Patent JP2023140144

Kind Code:

A

Abstract:

To provide a method for manufacturing a substrate with a roughened surface and a method for manufacturing a substrate with a plated layer, which enables easy production of the substrate with the plated layer.SOLUTION: One of the embodiments is a method for manufacturing a substrate with a roughened surface for forming wiring, comprising the step of performing laser ablation on a substrate containing at least resin on the surface, and the laser light irradiated in the laser ablation is a laser light with a pulse width of 1 ps or less, a wavelength of 320 nm or more and an output of 1 w or less.SELECTED DRAWING: Figure 2

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Inventors:

YANAGIMOTO HIROSHI
KUNO HISASHI
MURAI TATEYA
KURODA KEIJI
OKAZAKI TOMOYA
MORI RENTARO

Application Number:

JP2022046024A

Publication Date:

October 04, 2023

Filing Date:

March 22, 2022

Export Citation:

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Assignee:

TOYOTA MOTOR CORP

International Classes:

H05K3/18; C23C28/00

Attorney, Agent or Firm:

Patent Attorney Corporation Hiraki International Patent Office

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