Title:
METHOD FOR MANUFACTURING SURFACE MODIFIED MOLDING
Document Type and Number:
Japanese Patent JP2019199641
Kind Code:
A
Abstract:
To provide a method for manufacturing a surface modified molding without peeling an electrolytic plating film from the surface of the molding even when subjected to electrolytic plating using an acid plating solution by controlling plasma output and molding surface temperature within a predetermined range.SOLUTION: The method for manufacturing a surface modified molding comprises: an introduction step of setting the surface temperature of a molding including a fluororesin to 200°C or less and subjecting the surface of the molding to atmospheric pressure plasma treatment to introduce peroxide radicals; a grafting step of reacting a grafting agent with the surface after the introduction step; an electroless plating step of, after the grafting step, performing electroless plating; and an electrolytic plating step of, after the electroless plating step, performing electrolytic plating using an acid plating solution. In the atmospheric pressure plasma treatment, an output power density is 19 W/cmor less.SELECTED DRAWING: None
Inventors:
AKIYAMA DAISAKU
HIGASHIMATSU ITSURO
SAITO TOMOSHI
OKUBO YUJI
YAMAMURA KAZUYA
HIGASHIMATSU ITSURO
SAITO TOMOSHI
OKUBO YUJI
YAMAMURA KAZUYA
Application Number:
JP2018094857A
Publication Date:
November 21, 2019
Filing Date:
May 16, 2018
Export Citation:
Assignee:
MEC CO LTD
UNIV OSAKA
UNIV OSAKA
International Classes:
C23C18/20; C08J7/00; C23C18/38
Attorney, Agent or Firm:
Asfi International Patent Office
Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito
Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito