Title:
METHOD FOR MANUFACTURING THIN PIECE
Document Type and Number:
Japanese Patent JP3689362
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a thin piece having a thickness of 0.1-1000 μm and a diameter of 0.5-10,000 μm from a material having a high extension at break and a small tensile strength without causing problems on prior arts.
SOLUTION: In this method, a material to be processed into thin pieces is applied in a fluid or gaseous state to a support, and subsequently cured, removed from the support, and subjected to a shredding or crushing process. The material is repeatedly applied onto the support in a manner that a layered packet containing layers, each having a thickness of 0.2-1000 μm, in a cross section perpendicular to its surface occurs after the application. After the layered packet is peeled off from the support, the material is treated so as to be decomposed into each of the layers, which is crushed so that it has a particle size of 0.5-10,000 μm.
Inventors:
Horst liger
Franz-Heinrich Kreuzer
Adolf Glutner
Volker Staniek
Franz-Heinrich Kreuzer
Adolf Glutner
Volker Staniek
Application Number:
JP2001349119A
Publication Date:
August 31, 2005
Filing Date:
November 14, 2001
Export Citation:
Assignee:
Consortium fuer elektrochemische Industrie GmbH
International Classes:
B02C21/00; B05D1/38; B05D7/24; C09B67/00; C09B67/20; C09C3/04; C09K19/38; C09K19/58; (IPC1-7): C09C3/04; C09B67/20
Domestic Patent References:
| JP2001514319A | ||||
| JP2001515094A | ||||
| JP2002537149A |
Foreign References:
| US3138475 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel