To provide a method of manufacturing a transparent conductive film, which is superior in transparency, has low surface resistivity, has surface smoothness, and can be manufactured at low cost, and to provide the transparent conductive film.
The method of manufacturing the transparent conductive film includes processes of: (1) forming a pattern as a negative type shield mask 8 for a fine-wire mesh pattern by printing a solvent-soluble printing material on one surface of a transparent resin base 2; (2) forming a metal thin film 9 on the transparent resin base 2 by sputtering or vapor deposition while the shield mask 8 covers the transparent resin base 2; (3) dissolving the shield mask 8 away in a solvent to expose the fine-wire mesh pattern formed of metal thin films 5; and (4) partially or entirely coating projections of the fine-wire mesh pattern that the metal thin films 5 form and recessed openings 7 where the metal thin films 5 are not formed with a conductive resin layer 6 having transparency so that the projections are buried, a surface height difference of a coating surface of the conductive resin layer 6 being 50 to 400 nm.
MATSUDA TOSHIHARU
GOTO NOBUHIRO
| JP2004303914A | 2004-10-28 | |||
| JP2008149681A | 2008-07-03 | |||
| JP2006012737A | 2006-01-12 | |||
| JP2008034651A | 2008-02-14 | |||
| JP2009170887A | 2009-07-30 | |||
| JP2009237523A | 2009-10-15 | |||
| JP2007220789A | 2007-08-30 | |||
| JP2006201253A | 2006-08-03 |
| WO2009096124A1 | 2009-08-06 |
Takashi Watanabe