規定どおりに配向された改質線を有するウェハの製造方法

Japanese Patent JP7250695

B2

The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.

Marco Svoboda
Ralph Risuke
Christian bayer
Jan Richter

JP2019556844A

April 03, 2023

January 15, 2018

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Zyrtectra Gesellschaft Mitt Beschlenkter Hafzung

H01L21/304; B23K26/00; B23K26/03; B23K26/062; B23K26/067; B23K26/073; B23K26/38; B23K26/53; B28D5/00; B28D5/04; C30B33/02; C30B33/04

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WO2013065450A1

Einzel Felix-Reinhard
Reiko Otani
Taku Morita
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima class

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