Title:
METHOD OF MANUFACTURING WIRING BOARD AND METHOD OF MANUFACTURING DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2007123616
Kind Code:
A
Abstract:
To improve the operation efficiency of manufacture of a wiring board constituting a display device and to shorten a tact time.
The wiring board is manufactured through a wiring part forming stage, an optical inspection stage of detecting a defective wiring part where a defect occurs, and a defect correcting stage of correcting the defect of the defective wiring and in the defect correcting stage, a defect correction procedure previously stored in a database is read out selectively corresponding to the position relation between the defect and a finite number of regions constituting a wiring.
Inventors:
KOSHIISHI AKIRA
KAWABE HIDEO
MUKAI NOBUHIKO
TSUTSUI AKIKO
KAWABE HIDEO
MUKAI NOBUHIKO
TSUTSUI AKIKO
Application Number:
JP2005314967A
Publication Date:
May 17, 2007
Filing Date:
October 28, 2005
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K3/22; G09F9/00; H01L51/50; H05B33/10; H05B33/12
Domestic Patent References:
| JP2005221974A | 2005-08-18 | |||
| JP2003233329A | 2003-08-22 | |||
| JPH10177844A | 1998-06-30 | |||
| JPH0786722A | 1995-03-31 | |||
| JP2005072461A | 2005-03-17 |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hitoshi Ito
Hitoshi Ito