Title:
METHOD OF MANUFACTURING WIRING COMPONENT
Document Type and Number:
Japanese Patent JP2003079089
Kind Code:
A
Abstract:
To provide a manufacturing method for a wiring component that cuts out material effectively thereby reducing waste, and achieves substantial cost reduction.
A conductive solid wire is crushed into a flat sheet with a thickness of 3 mm or less and formed into a hollow disk-shaped conductive conductor 4. The hollow disk-shaped conductive conductor 4 is formed and fabricated into a prescribed shape to make a lead frame 1. A plurality of lead frames formed similarly is stacked with appropriate spacing, and the whole is integrally molded with a resin material.
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Inventors:
OUCHI KATSUAKI
ENDO KATSUO
MATSUO HIDEO
OGATA SHIJIO
NIHEI KIYOSHI
IWASHITA TSUKASA
ENDO KATSUO
MATSUO HIDEO
OGATA SHIJIO
NIHEI KIYOSHI
IWASHITA TSUKASA
Application Number:
JP2001263075A
Publication Date:
March 14, 2003
Filing Date:
August 31, 2001
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01R43/20; H01R43/24; H02K3/50; (IPC1-7): H02K3/50; H01R43/20; H01R43/24
Attorney, Agent or Firm:
Shigeru Kawasumi