Title:
METHOD FOR MANUFACTURING WOODY BOARD
Document Type and Number:
Japanese Patent JP2004025564
Kind Code:
A
Abstract:
To provide a method for manufacturing a woody board which can significantly enhance strength over the strength of conventional woody boards.
This method for manufacturing a woody board includes the steps of: coating an organic resin adhesive onto a woody material; and thermocompression-molding the assembly. Before the coating of the adhesive onto the woody material, a silane coupling agent or a partial hydrolyzate thereof is previously added to the organic resin adhesive, or alternatively the woody material is pretreated with the silane coupling agent or a partial hydrolyzate thereof.
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Inventors:
MATSUMURA KAZUYUKI
TANAKA MASAKI
TANAKA MASAKI
Application Number:
JP2002183758A
Publication Date:
January 29, 2004
Filing Date:
June 25, 2002
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
B27K3/34; B27N1/00; B27N3/08; (IPC1-7): B27N1/00; B27K3/34; B27N3/08
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Saori Shigematsu
Katsunari Kobayashi