Title:
METHOD FOR MEASURING NUMBER OF INSULATION BREAK POINTS IN METALIZED RESIN FILM
Document Type and Number:
Japanese Patent JP2022171318
Kind Code:
A
Abstract:
To provide a method for measuring the number of insulation break points in a metalized resin film allowing easy and accurate measurement of the number of insulation break points in a metalized resin film.SOLUTION: There is provided a method for measuring the number of insulation break points in a metalized resin film obtained by forming a first metal film on one side of a resin film, and the method includes a step 1 of applying voltage to a laminate obtained by laminating a conductive substrate, an insulator film formed with an opening, and the metalized resin film, and counting the number of insulation break points generated in the metalized resin film. The insulator film is arranged between the conductive substrate and the metalized resin film. The first metal film is arranged exposed on a surface of the laminate. The metalized resin film is in contact with the insulator film and is arranged in contact with the conductive substrate through the opening. In the step 1, an electrode is placed on a surface of the first metal film, and voltage is applied to the metalized resin film between the first metal film and the conductive substrate.SELECTED DRAWING: None
Inventors:
FUJISHIRO YOSHIKAZU
NAKADA MASAHIRO
ISHIWATARI TADAKAZU
TAKAGAKI TOSHITSUGU
NAKADA MASAHIRO
ISHIWATARI TADAKAZU
TAKAGAKI TOSHITSUGU
Application Number:
JP2021077900A
Publication Date:
November 11, 2022
Filing Date:
April 30, 2021
Export Citation:
Assignee:
OJI HOLDINGS CORP
International Classes:
H01G13/00
Attorney, Agent or Firm:
Saegusa International Patent Office