Title:
METHOD AND MOLD FOR MOLDING SYNTHETIC RESIN HOLLOW MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2985032
Kind Code:
B2
Abstract:
PURPOSE: To obtain a method and a mold for molding a synthetic resin hollow molded article without a leakage of a melt resin into the hollow article when a pair of semi- hollow molded pieces are bonded with each other at the peripheral edge parts thereof by injecting the melt resin and the deformation of the semi-hollow molded piece and to obtain a mold for molding a synthetic resin hollow molded article which can be cut at a gate.
CONSTITUTION: When a pair of semi-hollow molded pieces A, B are molded by primary molding, recessed and projected parts (d), (e), (f), (g), (h) are formed on bonding ends of the molded pieces. A melt resin is injected into a space (k) which is formed by the recessed and projected bonding end parts separated from each other. The melt resin is compressed by reducing the space (k) to bond the semi-hollow molded pieces A, B in a pair with each other at the bonding parts thereof. Alternatively, when a pair of semi-hollow molded pieces are molded by primary molding, recessed parts are formed on bonding ends of the molded pieces. A melt resin is injected into a runner part connected to a space, which is formed by the recessed bonding end parts abutted on each other. The melt resin in the runner part is charged into the space by compressing the runner part to bond the semi-hollow molded pieces in a pair as a hollow molded article.
Inventors:
NISHIDA SHOZO
Application Number:
JP20015692A
Publication Date:
November 29, 1999
Filing Date:
July 06, 1992
Export Citation:
Assignee:
NIPPON SEIKOSHO KK
International Classes:
B29B11/08; B29C33/42; B29C45/00; B29C45/14; B29C45/26; B29C45/56; B29D22/00; B29L22/00; (IPC1-7): B29C45/14; B29C45/26; B29C45/56
Domestic Patent References:
| JP4175118A | ||||
| JP6287315A | ||||
| JP491914A | ||||
| JP59165632A |
Attorney, Agent or Firm:
Yoshiaki Sugitani (1 outside)