Title:
METHOD FOR MOLDING DIPPING NOZZLE AND ITS MOLD
Document Type and Number:
Japanese Patent JP3510470
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for molding a dipping nozzle which can mold a molding easily in a high precision and at low costs and its molding mold.
SOLUTION: In a method for molding a dipping nozzle by hydrostatic pressure molding and its mold, a core 12 is made split mold structure, and after a mold 11 being pressurized to mold a raw material, the core 12 is divided to be extracted, and the dipping nozzle is molded. The mold for molding the dipping nozzle is composed of a mold used for the hydrostatic pressure molding of the dipping nozzle, an outside mold, and the core, a split mold, arranged in the outside mold.
More Like This:
Inventors:
Iwakawa, Kazuhiro
Nagae, Mitsuyoshi
Nagae, Mitsuyoshi
Application Number:
JP4744898A
Publication Date:
March 29, 2004
Filing Date:
February 27, 1998
Export Citation:
Assignee:
TOSHIBA CERAMICS CO LTD
International Classes:
B28B21/86; (IPC1-7): B28B21/86
Attorney, Agent or Firm:
波多野 久 (外1名)
Previous Patent: COPPER ALLOY FOR ELCTRICALLY CONDUCTIVE SPRING AND ITS PRODUCTION
Next Patent: STEEL MATERIAL FOR HIGH TEMPERATURE SODIUM
Next Patent: STEEL MATERIAL FOR HIGH TEMPERATURE SODIUM