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Patent Searching and Data


Title:
METHOD FOR MOLDING SPIGOT PART OF PIPE BODY
Document Type and Number:
Japanese Patent JP3112344
Kind Code:
B2
Abstract:

PURPOSE: To improve finish appearance at the time of the mutual bonding of pipe bodies by heating and curing the end part of a plastic pipe body and applying drawing processing thereto by an inner mold having recessed and protruding stripes provided to the surface thereof in the longitudinal direction and an outer mold having the protruding and recessed stripes corresponding to those of the inner mold to form a spigot part having peripheral length same as that of a raw pipe.
CONSTITUTION: Recessed and protruding stripe parts 11 are provided on the surface of an inner mold 11 in the londitudinal direction thereof and an outer mold 2 consists of an upper mold 2-1 and a lower mold 2-2 and the protruding and recessed stripe parts 21 corresponding to the recessed and protruding stripe parts 11 of the inner mold 1 are provided to the inner surface of the outer mold 2. The gap formed when the inner mold 1 is covered with the outer mold 2 to clamp both molds is set so as to correspond to the wall thickness of a pipe body A and the inner peripheral length of the outer mold 2 provided with the recessed and protruding stripe parts 21 is made almost same as the original peripheral length of the pipe body A. The end part of the pipe body A is heated and cured to be fitted in the inner mold 1 and the outer mold 2 is closed to be clamped on the inner mold 1. When the pipe body A is pulled out of the inner mold 1, the pipe body A is subjected to embossing processing and contracted in its diameter by the quantity corresponding to the wall thickness of the pipe body A and a spigot part having peripheral length same as a raw pipe is formed.


Inventors:
Masafumi Katahira
Application Number:
JP16303692A
Publication Date:
November 27, 2000
Filing Date:
June 22, 1992
Export Citation:
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Assignee:
Mitsubishi Plastics Co., Ltd.
International Classes:
B29C57/00; (IPC1-7): B29C57/00
Domestic Patent References:
JP52147679A