Title:
METHOD OF MONITORING SIZE FOR SEMICONDUCTOR FABRICATION
Document Type and Number:
Japanese Patent JPS59191335
Kind Code:
A
Abstract:
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing is provided. A fixed pattern of scale images on the surface with a predetermined distance between images, together with a wedge-shaped element is provided on the surface. The wedge element has an apex adjacent one of the images and extends in a direction along other ones of the images. The semiconductor body is processed and the dimensions of the wedge-shaped element (as well as the scale image) change. One may then subsequently visually inspect the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of the wedge shaped element during processing.
Inventors:
PEIIMINGU DANIERU JIYOU
KIIIFUEI KURISU CHII
KIIIFUEI KURISU CHII
Application Number:
JP11682183A
Publication Date:
October 30, 1984
Filing Date:
June 27, 1983
Export Citation:
Assignee:
ROCKWELL INTERNATIONAL CORP
International Classes:
G01B11/02; H01L21/027; H01L21/30; H01L21/306; H01L21/66; (IPC1-7): H01L21/30; H01L21/306
Attorney, Agent or Firm:
Kuro Fukami