Title:
METHOD OF MOUNTING COMPONENT ON PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH01189991
Kind Code:
A
Abstract:
PURPOSE:To decrease the mandays of operation, and to prevent the rise of solder accurately to a through-hole for a subsequently mounted part by inserting a pin on soldering into the through-hole for the subsequently mounted component in a printed wiring board and soldering the part. CONSTITUTION:A wiring, a through-hole 2, etc., are formed to a printed board base material 3, and a solder resist 4 is applied to unnecessary sections in order to prevent the adhesion of solder. When components such as an IC, a capacitor, a resistor, etc., are mounted automatically, a tapered pin 1, which has heat resistance and solder release characteristics, is inserted simultaneously into the through-hole 2 for a subsequently mounted component, and the components are soldered. The pin 1 is drawn out, a lead terminal for the subsequently mounted part is inserted into the through-hole 2, and the part is soldered and mounted. Accordingly, no solder adheres on the through-hole 2 for the subsequently mounted component, the same effect as masking is acquired, and mandays performing the prevention of the rise of solder can be decreased largely.
Inventors:
SHINGU KEIJI
Application Number:
JP1615388A
Publication Date:
July 31, 1989
Filing Date:
January 26, 1988
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K3/34; H05K3/00; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Uchihara Shin