Title:
METHOD FOR MOUNTING ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3667229
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts by which electronic parts with leads can be transferred to and mounted on a board at a high speed by recognizing the positions of the parts with high accuracy and high workability.
SOLUTION: In the method for mounting electronic parts, a first image picking-up section 5, a second image picking-up section 6 composed of an area camera, and a height measuring instrument 7 composed of a laser unit are used. A transfer head 20 moves above the first image picking-up section 5 and detects the positional deviations of the leads L of electronic parts 9. Then the parts 9 are mounted on a substrate by adjusting the position of the parts 9 until the laser spot from the height measuring instrument 7 hits the leads L of the parts 9 and measuring the floating of the leads L.
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Inventors:
Yasuhiro Kashiwagi
Kazuhide Nagao
Kazuhide Nagao
Application Number:
JP2000373911A
Publication Date:
July 06, 2005
Filing Date:
March 14, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Domestic Patent References:
| JP393299A | ||||
| JP5335792A | ||||
| JP376299A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito