PURPOSE: To connect pads directly, and to enable the high density packaging of an IC chip by connecting an electrode on the IC chip to a wiring on a substrate, to which the IC chip is packaged, by particulates having conductivity and fixing the IC chip with insulating adhesives.

CONSTITUTION: Resin spheres 2 having diameters (5W25μm) of one tenth or less of IC pad pitches are sprayed with an air gun against an IC-chip packaging substrate, in which substrate pads 1 are fitted where opposite to IC pads 4 for an IC chip 3, thus uniformly dispersing the resin spheres 2. The surfaces of the resin spheres 2 are plated previously with nickel and gold through an electroless plating method. The IC chip 3 and the pads 1 for the substrate are faced oppositely, IC chips 3 is judged whether nondefective or defective with the IC chip 3 and the pads 1 for the substrate faced oppositely and pressure- welded through the resin spheres 2, and the defective IC chips 3 are exchanged. The periphery of the IC chip 3 is heated and fastened by thermosetting epoxy adhesives 5 under the state in which the IC chip 3 is pressure-welded on the nondefective IC chips 3.