METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS

Japanese Patent JP2014141305

A

PROBLEM TO BE SOLVED: To provide a packaging material which facilitates delivery and removal of a tacky product, such as a thermal interface pad, by thermal interface installation equipment.SOLUTION: A package for delivery of a tacky product having a base contact modulus of less than 50 Shore 00 comprises: a carrier tape having an upper surface and a plurality of cavities separately disposed in said upper surface along a length thereof, each of said cavities including a base that is sized to operably receive and support said product, said base having a base surface area and a surface profile defining a delineated first contact surface area that is less than 50% of said base surface area; and a cover tape having a first side removably securable to said upper surface of said carrier tape, said first side having a contact portion capable of contacting the product, said first side having a surface texture including an embossed portion defining a delineated second contact surface area that is less than 50% of said contact portion of said cover tape.

RADESH JEWRAM
WILLIAM E MCINTOSH

JP2014037111A

August 07, 2014

February 27, 2014

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BERGQUIST CO THE

B65B15/04; B65D85/86; B65D73/02

JPH11105923A	1999-04-20
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JPH10122836A	1998-05-15
JP2003165514A	2003-06-10
JPH07149365A	1995-06-13
JP2005311160A	2005-11-04
JP2008115356A	2008-05-22
JPH0714950A	1995-01-17
JPH0252765U	1990-04-16
JPH0378771U	1991-08-09
JP2006213374A	2006-08-17
JP2002362677A	2002-12-18
JPH0521989A	1993-01-29
JP2002211637A	2002-07-31
JP2005035636A	2005-02-10
JPH01122493U	1989-08-21

US5526935A

1996-06-18

Asamura patent office

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