Title:
METHOD FOR PACKING MICRORECESSES AND APPARATUS THEREFOR
Document Type and Number:
Japanese Patent JPH1192955
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enable the use of materials, such as copper and copper alloys, having a low specific electric resistance as a packing material by immersing base materials having microrecesses into a plating liquid and mechanically exciting a plating tank or the base materials themselves, thereby packing the prescribed material into the microrecesses. SOLUTION: A treating vessel 10 is installed on an electromagnetic exciting device 11 and the plating tank 12 is housed in this treating vessel 10. The many semiconductor base materials 1 are erected in parallel in the plating tank 12. The entire part of the plating tank 12 is excited by the electromagnetic exciting device 11 during the plating stage to the semiconductor base materials 1. The number of vibration in the case of the excitation is specified to 1 Hz to 10 MHz and the max. amplitude thereof to 0.8 mm. As a result, the microvibration, scattering, defoaming, dispersing, emulsifying, fragmentation of clusters, etc., of the plating liquid occur. Consequently, the infiltration of the plating liquid into contact holes and grooves which are the microrecesses is accelerated. The similar effect is obtainable even if the semiconductor base materials 1 themselves are connected to the electromagnetic exciting device 11.
Inventors:
KOGURE NAOAKI
Application Number:
JP26930197A
Publication Date:
April 06, 1999
Filing Date:
September 16, 1997
Export Citation:
Assignee:
EBARA CORP
International Classes:
C23C18/16; C23C18/31; C25D3/38; C25D5/48; C25D7/12; H01L21/288; H01L21/3205; (IPC1-7): C23C18/31; C23C18/16; H01L21/288; H01L21/3205
Attorney, Agent or Firm:
Isamu Watanabe (2 outside)
Previous Patent: METHOD FOR PACKING MICRORECESSES AND APPARATUS THEREFOR
Next Patent: TANK INSIDE CONSTRUCTION WORK SCAFFOLDING DEVICE
Next Patent: TANK INSIDE CONSTRUCTION WORK SCAFFOLDING DEVICE