Title:
粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法
Document Type and Number:
Japanese Patent JP5929419
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition which has adhesive force required when it is pasted on an adhered material, even in a high temperature environment of about 200°C, and decreases its adhesive force when it is heated at a prescribed temperature of over 200°C; and to provide a film-like adhesive using the adhesive composition concerned and a method for peeling an adhered material.SOLUTION: An adhesive composition includes: at least one condensed-system resin selected from the group consisting of a polyamideimide resin, a polyimide resin and a polyamide resin; and at least one additive selected from the group consisting of a material which becomes brittle due to heat, a thermally shrinkable material and a thermally expandable material.
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Inventors:
Katsuyuki Masuda
Shinada Ei
Masatoshi Yamaguchi
Sugimoto Yasushi
Shigeru Koibuchi
Kazunori Yamamoto
Shinada Ei
Masatoshi Yamaguchi
Sugimoto Yasushi
Shigeru Koibuchi
Kazunori Yamamoto
Application Number:
JP2012077840A
Publication Date:
June 08, 2016
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J177/00; C09J5/08; C09J7/00; C09J11/06; C09J177/06; C09J179/08
Domestic Patent References:
| JP2002518544A | ||||
| JP2004186280A | ||||
| JP2002533500A | ||||
| JP60028423A |
Foreign References:
| WO2011118506A1 | ||||
| WO2005087888A1 | ||||
| WO2009150818A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Yoshinori Shimizu
Junichiro Sakamaki