Title:
METHOD FOR PLACING STIFFENER TO FLEXIBLE SUBSTRATE
Document Type and Number:
Japanese Patent JP3290397
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To place a flexible substrate to a stiffener with a high stiffness and to avoid a deterioration due to a crack by allowing the pressure-sensitive adhesive surface of the stiffener to oppose the reverse side of a flexible substrate with a solder ball with a space, sending vacuum and fixing the positions of the flexible substrate and the stiffener, and pressurizing an area around the solder ball.
SOLUTION: A flexible substrate 10' is formed at a flexible tape with a circuit and a solder ball and is subjected to vacuum support at a specific position. A stiffener 29 has a pressure-sensitive adhesive 30 on a surface that faces the substrate 10'. An auxiliary support body 31 has a compliant block consisting of silicon rubber so that a support force to be given becomes uniform. A ram 34 gives an upward force and moves the stiffener 29 in a form where it faces the surface of the substrate 10' being opposite to the surface with the solder ball, so that the pressure-sensitive adhesive 30 places the stiffener 29 on the substrate l0'. When the stiffener 29 is engaged to the substrate 10' due to the move of the ram 34, the force reaches approximately 2,000 pound per square inch in a certain amount of time.
Inventors:
Michael axial
Richard Ronald Hall
Robert Nicholas Ives
Richard Ronald Hall
Robert Nicholas Ives
Application Number:
JP1529898A
Publication Date:
June 10, 2002
Filing Date:
January 28, 1998
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L21/48; H01L23/12; H01L23/498; H05K3/22; H01L23/538; H05K3/00; H05K1/00; H05K3/34; (IPC1-7): H05K3/00; H01L23/12; H05K3/22
Domestic Patent References:
| JP922962A | ||||
| JP927563A |
Other References:
【文献】国際公開97/537(WO,A1)
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)