Title:
METHOD FOR PLATING POLYMER FORMING MATERIAL, CIRCUIT FORMING COMPONENT AND METHOD FOR MANUFACTURING THE CIRCUIT FORMING COMPONENT
Document Type and Number:
Japanese Patent JP3399434
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit forming component by which a multilayer, e.g. >3, circuit having an optional shape is easily manufactured at a low cost.
SOLUTION: A polymer material filled with an inorganic filler is diluted with a solvent and applied on a substrate 20 to be coated with resin to form an insulating layer 24-1 in an insulating layer forming stage, the insulating layer 24-1 formed in the insulating layer forming stage is treated with a laser to form a circuit forming part and a via hole 25 in a circuit forming part forming stage, and the circuit forming part and via hole 25 formed in the circuit forming part forming stage are plated to form a circuit 23-1 in a circuit forming stage. The insulating layer forming stage, circuit forming part forming stage and circuit forming stage are repeated plural times in this order to manufacture a circuit forming component (multilayer substrate).
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Inventors:
Hirokazu Tanaka
Satoshi Hirono
Satoshi Hirono
Application Number:
JP2000035521A
Publication Date:
April 21, 2003
Filing Date:
February 14, 2000
Export Citation:
Assignee:
Omron Corporation
International Classes:
C23C18/20; C23C18/16; C25D5/54; C25D5/56; C25D7/00; H05K3/18; H05K3/46; H05K3/00; (IPC1-7): C23C18/20; C25D5/54; C25D7/00; H05K3/18; H05K3/46
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Attorney, Agent or Firm:
Teruo Aoki