Title:
METHOD FOR PLATING TRANSPARENT CONDUCTIVE FILM PATTERN
Document Type and Number:
Japanese Patent JPH01116084
Kind Code:
A
Abstract:
PURPOSE:To apply plating to the above pattern with high selectivity by applying catalytic treatment to a transparent conductive film pattern on a glass and then plating the above with an electroless nickel plating bath containing fluorine compounds. CONSTITUTION:A transparent conductive film pattern on a glass is subjected to degreasing, washing, surface activation, catalyst supply, and then catalytic activation, by which the surface is subjected to soft etching and formed into rugged state. When plating is applied then by using an electroless nickel plating bath containing fluorine compounds, etching is performed from the cross sections (side faces) of projecting parts by means of the fluorine compounds in the plating bath even if the tops of the projecting parts are plated and, as a result, no plating is applied to the insulating substrate part of glass, etc., after all. By this method, plating can easily be applied to the transparent conductive film with superior selectivity.
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Inventors:
YAHAGI SEIJI
Application Number:
JP27394587A
Publication Date:
May 09, 1989
Filing Date:
October 29, 1987
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
C23C18/34; C23C18/16; (IPC1-7): C23C18/34
Domestic Patent References:
| JPS59149326A | 1984-08-27 |
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