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Title:
METHOD FOR POLISHING CHIP RAKE SURFACE OF CHIP SAW AND ITS DEVICE
Document Type and Number:
Japanese Patent JP2015020271
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for polishing a chip rake surface of a chip saw and its device in which the chip rake surface can be polished in the R-shape of a small curvature to sufficiently increase the cutting ability, and the efficiency of polishing the rake surface can be improved.SOLUTION: A method is provided for polishing a chip rake surface of a chip saw with chips 6 fixed thereon, in a chip fixing part of an outer peripheral edge of a base metal with a mounting hole formed at a center portion. Multiple pieces of chips 6 are disposed in a row state on a table 11 with the rake surface 6a as the upper part. The rake surface 6a of each chip 6 is polished by bringing the rake surface 6a of the chip 6 into abutment with the outer circumferential surface of the R-shape, while rotating a flat diamond grinding wheel 12 disposed upward of the chip 6, and the ground chip 6 is fixed to the chip fixing part of the base metal. Also, in the polishing by the flat diamond grinding wheel 12, it is polished while the positional relationship between the table 11 and the flat diamond grinding wheel 12a is relatively changed.

Inventors:
ASADA YOSHIHIKO
Application Number:
JP2013163608A
Publication Date:
February 02, 2015
Filing Date:
July 19, 2013
Export Citation:
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Assignee:
TRIGGER KK
International Classes:
B24B3/36; B23D63/14
Domestic Patent References:
JP2011051062A2011-03-17
JPH11347900A1999-12-21
JP2011051062A2011-03-17
JPS5928447U1984-02-22



 
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