To provide a method of processing a wafer in which a DAF (Die Attach Film) is never adhered to a dicing tape and which uses a laser beam.
The method of processing the wafer on the rear surface of which a die attach film supported with the dicing tape is arranged, includes an energy reduction region forming process of forming an energy reduction region where the energy of a laser beam is reduced at the intersection of a first predetermined division line and a second predetermined division line, a first dividing process of positioning the laser beam at the first predetermined division line for irradiation and performing relative machining feeding of a chuck table and a laser beam irradiation unit to divide the wafer and die attach film along the first predetermined division line, and a second dividing process of positioning the laser beam at the second predetermined division line for irradiation and performing relative machining feeding of the chuck table and laser beam irradiation unit to divide the wafer and die attach film along the second predetermined division line.
JP5473415 | Laser processing equipment |
WO/2024/024852 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND EXPANDABLE TAPE |
JPH062270 | A semiconductor pellet stripping device |
JPH04167985A | 1992-06-16 | |||
JP2008235398A | 2008-10-02 |
Kenji Ito